Heterogeneous integration by adhesive bonding
نویسندگان
چکیده
منابع مشابه
Heterogeneous Photonic Integration by Direct Wafer Bonding
The silicon (Si) photonics platform has emerged as a promising integration platform for use in many applications, particularly datacenter communications, which is expected to produce demand for large numbers of low cost photonic integrated circuits (PICs). Sibased PICs are almost universally based on Si-on-insulator (SOI) wafers, which are enabled by wafer bonding technology. Si is useful as a ...
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Three-dimensional (3D) integration is an emerging technology that vertically stacks and interconnects multiple materials, technologies and functional components to form highly integrated micro/nano-systems. This paper reviews the materials and technologies for three wafer bonding approaches to 3D integration using adhesive, metal, and metal/adhesive as the bonding interfaces. Similarities and d...
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ژورنال
عنوان ژورنال: Micro and Nano Systems Letters
سال: 2013
ISSN: 2213-9621
DOI: 10.1186/2213-9621-1-3